Intel S1200V3RP Technical Product Specification

Environmental Limits Specification Intel® Server Board S1200V3RP TPS
Revision 1.2
212
the responsibility of the system integrator who chooses not to use Intel developed server
building blocks to consult vendor datasheets and operating parameters to determine the amount
of airflow required for their specific application and environmental conditions. Intel Corporation
cannot be held responsible, if components fail or the server board does not operate correctly
when used outside any of their published operating or non-operating limits.
12.2 MTBF
The following is the calculated Mean Time Between Failures (MTBF) 40 degree C (ambient air).
These values are derived using a historical failure rate and multiplied by factors for application，
electrical and/or thermal stress and for device maturity. You should view MTBF estimates as
“reference numbers” only.
 Calculate standard: Telcordia* issue 2
 Calculate Method: Method I-D
 Temperature = 40 degree C
 Environment = GB, GC – Ground Benign, Controlled
 Model = Serial
 Duty cycle = 100%
 Component Quality: Level II
 Adhere to De-rating data
Table 62. MTBF Estimate
Assembly Name
Temperature (Degree C)
MTBF (hours)
Intel
®
Server Board
S1200V3RPL
40
283,887
Intel
®
Server Board
S1200V3RPS
40
290,843
Intel
®
Server Board
S1200V3RPO
40
286,078
Intel
®
Server Board
S1200V3RPM
40
277,497

Intel S1200V3RP Specifications

General

Brand	Intel
Model	S1200V3RP
Category	Server Board
Language	English