Rockwell Automation Publication 750-IN100B-EN-P - July 2017 31
Prepare for Installation Chapter 3
Location Planning
Consider the following when planning the location for your PowerFlex 755T
product.
• Environment - temperature, humidity, and vibration or shock
• Ventilation and air conditioning
• Input power cable entry points
• Motor cable exit points
•Product dimensions (See page 39
for Approximate Dimensions.)
• Overall height of installation area
•Alignment with other equipment
• Future needs
Mounting Surface
Install the product on a flat and level surface such that all enclosures in the line-
up are with ±0.25 mm (0.010 in.) vertical orientation. If necessary use metal
shims to level the enclosures before joining them.
• Install product enclosures in an upright orientation.
• Verify that the product enclosures are square, vertical, and stable.
Various mounting options are acceptable.
• Corner base/plinth system
• Structural steel system
•Anchor bolt system
• Concrete screw system
Environment
The installation site must be compatible with the degree of protection
provided by the enclosure.
• PowerFlex 755T products are only intended for indoor use.
• Protect the equipment from moisture and direct sunlight.
• Do not expose to a corrosive atmosphere.
• Protect fans and electronics by avoiding dust or metallic particles
Ambient temperature IP21, UL Type 1:
IP54, UL Type 12:
-20…+40 °C (-4…+104 °F) Frames 8…12, all ratings
-20…+40 °C (-4…+104 °F) Frames 8…12, all ratings
Ambient temperature of 50 °C (122 °F) or 55 °C (134 °F) with derating.
Storage temperature -40…+70 °C (-40…+158 °F)
Relative humidity 5…95% non-condensing
Atmospheric protection Harsh environment is defined as a copper or silver reactivity level greater than 1000
angstroms per 30 days exposure. No condensation allowed. Maximum allowable
humidity is 60% in the presence of corrosive gases. See ISA-71.04-2013 for details on
how to measure reactivity levels on copper and silver test coupons.
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