Quectel LTE-A Series User Manual

LTE-A Module Series
EG060V-EA Hardware Design
EG060V-EA_Hardware_Design 70 / 82
Below are two reference designs of heatsink. You can choose one or both of them according to
application structures.
Heatsink
Module
Application Board
Application Board
Heatsink
Thermal Pad
Shielding Cover
Figure 39: Reference Design of Heatsink (Heatsink at the Top of the Module)
Thermal Pad
Heatsink
Application Board
Application Board
Heatsink
Thermal Pad
Module
Shielding Cover
Figure 40: Reference Design of Heatsink (Heatsink at the Backside of PCB)
1. Make sure that your PCB design provides sufficient cooling for the module: proper mounting,
heatsinks, and active cooling may be required depending on the integrated application.
2. To protect components from being damaged, the thermal design should be optimized to the largest
NOTES

Quectel LTE-A Series Specifications

General

Brand	Quectel
Model	LTE-A Series
Category	Control Unit
Language	English