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HP Elite x2 G8 User Manual

HP Elite x2 G8
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Table 4-1 Static electricity occurrence based on activity and humidity (continued)
Relative humidity
Motions of bench worker
Removing DIPs (dual in-line packages) from plastic tube
400 V
400 V
800 V
700 V
6,000 V
2,000 V
Removing DIPs from vinyl tray
Removing DIPs from polystyrene foam
Removing bubble pack from PCB (printed circuit board)
Packing PCBs in foam-lined box
2,000 V
3,500 V
7,000 V
5,000 V
4,000 V
5,000 V
20,000 V
11,000 V
11,500 V
14,500 V
26,500 V
21,000 V
Multiple electric components can be packaged together in plastic tubes, trays, or polystyrene foam.
NOTE: As little as 700 V can degrade a product.
Preventing electrostatic damage to equipment
Many electronic components are sensitive to ESD. Circuitry design and structure determine the degree of
sensitivity. The following packaging and grounding precautions are necessary to prevent static electricity
damage to electronic components.
To avoid hand contact, transport products in static-safe containers such as tubes, bags, or boxes.
Protect all electrostatic parts and assemblies with conductive or approved containers or packaging.
Keep electrostatic-sensitive parts in their containers until they arrive at static-free stations.
Place items on a grounded surface before removing them from their container.
Always be properly grounded when touching a sensitive component or assembly.
Avoid contact with pins, leads, or circuitry.
Place reusable electrostatic-sensitive parts from assemblies in protective packaging or conductive foam.
Personal grounding methods and equipment
Using certain equipment can prevent static electricity damage to electronic components.
Wrist straps are exible straps with a maximum of 1 MΩ ±10% resistance in the ground cords. To provide
proper ground, a strap must be worn snug against bare skin. The ground cord must be connected and t
snugly into the banana plug connector on the grounding mat or workstation.
Heel straps/Toe straps/Boot straps can be used at standing workstations and are compatible with most
types of shoes or boots. On conductive oors or dissipative oor mats, use them on both feet with a
maximum of 1 MΩ ±10% resistance between the operator and ground.
Table 4-2
Static shielding protection levels
Static shielding protection levels
Method Voltage
Antistatic plastic
Carbon-loaded plastic
1,500
7,500
Preventing electrostatic damage to equipment 33

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HP Elite x2 G8 Specifications

General IconGeneral
Form factorConvertible (Detachable)
Product typeHybrid (2-in-1)
Product colorSilver
Country of originChina
Market positioningPremium
Original brand nameHP
HD type3K2K
Color gamut72 %
Display surfaceGloss
RGB color spaceNTSC
Display diagonal13 \
Anti-glare screenAlways gives an optimal view, even in direct sunlight.
Display brightness450 cd/m²
Display resolution3000 x 2000 pixels
Display diagonal (metric)33 cm
Numeric keypadNo
Pointing deviceClickpad
Internal memory16 GB
Memory clock speed4266 MHz
Memory form factorOn-board
Internal memory typeLPDDR4x-SDRAM
HP segmentBusiness
HP speaker typeHP Dual Speakers
SSD capacityThe Solid State Drive's storage capacity in Gigabytes.
SSD interfaceNVMe, PCI Express
Storage mediaSSD
SSD memory typeTLC
Total storage capacity512 GB
Number of SSDs installed1
Repairability index8.4
Battery weight190 g
Battery capacity47 Wh
Number of battery cells2
Discrete graphics card modelNot available
On-board graphics card modelIntel Iris Xe Graphics
Front camera HD typeFull HD
Antenna type2x2
Wi-Fi standardsWi-Fi 6 (802.11ax)
Bluetooth version5.0
WLAN controller modelIntel Wi-Fi 6 AX201
WLAN controller manufacturerIntel
Charging port typeUSB Type-C
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
USB 3.2 Gen 1 (3.1 Gen 1) Type-C ports quantity0
Processor cache8 MB
Processor cores4
Processor familyIntel® Core™ i5
Processor threads8
Configurable TDP-up28 W
Processor frequency- GHz
Processor cache typeL3
Configurable TDP-down12 W
Processor boost frequency4.4 GHz
Configurable TDP-up frequency2.6 GHz
Configurable TDP-down frequency1.1 GHz
AC adapter power65 W
Operating system installedWindows 11 Pro
Package depth483 mm
Package width69 mm
Package height305 mm
Weight and Dimensions IconWeight and Dimensions
Depth221.9 mm
Height14.2 mm
Weight1170 g
Depth (tablet mode)215.8 mm
Width (tablet mode)289.3 mm
Height (tablet mode)8.8 mm
Weight (tablet mode)820 g

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