Disassembly/Reassembly Procedures: Serviceable Components of the Main Sub-Assemblies 8-11
8.5.1.2 Servicing Thermal Pad:
1. Complete steps from Section 8.4.4.1. through Section 8.4.4.3.
2. Carefully peel off the pad.
3. Ensure there is no debris or residue left on the amplifier’s surface.
4. Replace with new Thermal Pad.
5. Peel the liner off the new pad and place in the respective location. Make sure the bottom
surface of the pad is mating with the top surface of the amplifier.
6. Apply slight pressure to activate the adhesive.
8.5.2 Servicing Chassis Assembly
Figure 8-14. Serviceable Components – Chassis Assembly
NOTE: When servicing NFC Assy Flex, assemble the NFC Assy Flex first before assembling back
the poron.
Thermal pad should always be replaced when the Main board
assembly is removed.
1
2
3
4
5
6
7
8
9
11
10
12
13
14
To Next Page
Loading...
Need help?
General
