1.Precautions
1.3.ESDprecautions
Certainsemiconductordevicescanbeeasilydamagedbystaticelectricity.Suchcomponentsarecommonlycalled
“ElectrostaticallySensitive(ES)Devices”orESDs.ExamplesoftypicalESDsare:integratedcircuits,someeldeffect
transistors,andsemiconductor“chip”components.Thetechniquesoutlinedbelowshouldbefollowedtohelpreducethe
incidenceofcomponentdamagecausedbystaticelectricity.
CAUTION
Besurenopowerisappliedtothechassisorcircuit,andobserveallothersafetyprecautions.
1)Immediatelybeforehandlingasemiconductorcomponentorsemiconductor-equippedassembly,drainoffany
electrostaticchargeonyourbodybytouchingaknownearthground.Alternatively,employacommerciallyavailable
wriststrapdevice,whichshouldberemovedforyourpersonalsafetyreasonspriortoapplyingpowertotheunit
undertest.
2)AfterremovinganelectricalassemblyequippedwithESDs,placetheassemblyonaconductivesurface,suchas
aluminumorcopperfoil,orconductivefoam,topreventelectrostaticchargebuildupinthevicinityoftheassembly.
3)UseonlyagroundedtipsolderingirontosolderordesolderESDs.
4)Useonlyan“anti-static”solderremovaldevice.Somesolderremovaldevicesnotclassiedas“anti-static”can
generateelectricalchargessufcienttodamageESDs.
5)DonotuseFreon-propelledchemicals.Whensprayed,thesecangenerateelectricalchargessufcienttodamageESDs.
6)DonotremoveareplacementESDfromitsprotectivepackaginguntilimmediatelybeforeinstallingit.Most
replacementESDsarepackagedwithallleadsshortedtogetherbyconductivefoam,aluminumfoil,oracomparable
conductivematerial.
7)ImmediatelybeforeremovingtheprotectiveshortingmaterialfromtheleadsofareplacementESD,touchtheprotective
materialtothechassisorcircuitassemblyintowhichthedevicewillbeinstalled.
8)MaintaincontinuouselectricalcontactbetweentheESDandtheassemblyintowhichitwillbeinstalled,until
completelypluggedorsolderedintothecircuit.
9)MinimizebodilymotionswhenhandlingunpackagedreplacementESDs.Normalmotions,suchasthebrushingtogether
ofclothingfabricandliftingone’sfootfromacarpetedoor,cangeneratestaticelectricitysufcienttodamageanESD.
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