Emerson Process Management GmbH & Co. OHG1-10
X-STREAM XE
Short Form Manual
HASXEE-SFM-HS
05/2017
1.5 X-STREAM XEXF Field Housings
1.5 X-STREAM XEXF: Field Housing With Single (XEF) or Dual (XDF) Compartment
The eld housing model is conceived for
outdoor use and wall-mounting. The coated
stainless steel housing has a protection
class rated IP66 / NEMA Type 4X, offering
protection against water and dust entering
the device:
IPx6: In case of occasional ooding, e.g.
heavy seas, water shall not enter in harmful
quantities
IP6x: Protection against penetration by dust.
Live or internal moving parts are completely
protected.
An X-STREAM eld housing can be tted with
up to ve measurement channels in many
combinations. The physical components
can optionally be encased in a cover. This
separate volume can be held at a specic
temperature of up to 60 °C (140 °F) to mini-
mize interference from changes in external
temperature.
Front panel
The analyzer’s display is
covered by an impact
tested glass for enhanced protection against
breakage in harsh environments.
Electrical connections
Electrical connections are provided via inter-
nal tube ttings, the cables being fed through
cable glands at the right side of the unit
( Fig. 1-4). The front cover of the hous-
ing swings open to the left once the fasteners
have been released.
Connection to power supply
Mains power is supplied via screw-type termi-
nals with integrated fuse holders at the right
side of the housing, near the front. The wide
range power supply unit mounted internally
enables the analyzers to be used worldwide.
Interface signals
Up to two digital I/O cards may be installed.
If so, on a label nearby, they are labeled
"X4.1" for the rst I/O board, and "X4.2" for
the second.
Note!
X-STREAM Enhanced gas analyzers feature
at maximum eight gas connectors. So, full
parallel tubing is not possible for ve channel
congurations (at least two out of ve chan-
nels need to be serial tubed)!
Dual compartment version XDF
This variation not only provides more space
for additional internal components, but also
the option to add a gastight separation of
electronics and physics. In this case, power
suppy units and electronic boards are installed
in the upper compartment, while the measur-
ing components are installed in the lower
compartment.