List of Illustrations
Section 1 General Information
Figure 1-1. Typical system configuration for applications. . .1-1
Section 2 Two-terminal Device Tests
Figure 2-1. Series 2600 two-wire connections
(local sensing) . . . . . . . . . . . . . . . . . . . . . . .2-1
Figure 2-2. Voltage coefficient test configuration . . . . . . .2-1
Figure 2-3. Test configuration for capacitor leakage test . . .2-3
Figure 2-4. Staircase sweep . . . . . . . . . . . . . . . . . .2-5
Figure 2-5. Test configuration for diode characterization. . .2-5
Figure 2-6. Program 3 results: Diode forward
characteristics . . . . . . . . . . . . . . . . . . . . . . .2-6
Section 3 Bipolar Transistor Tests
Figure 3-1. Test configuration for common-emitter tests . . 3-1
Figure 3-2. Program 4 results: Common-emitter
characteristics . . . . . . . . . . . . . . . . . . . . . . 3-3
Figure 3-3. Gummel plot test configuration. . . . . . . . . 3-4
Figure 3-4. Program 5 results: Gummel plot . . . . . . . . 3-5
Figure 3-5. Test configuration for current gain tests
using search method . . . . . . . . . . . . . . . . . . . 3-6
Figure 3-6. Test configuration for fast current gain tests . . 3-8
Figure 3-7. Configuration for I
CEO
tests . . . . . . . . . . . 3-11
Figure 3-8. Program 8 results: I
CEO
vs. V
CEO
. . . . . . . . . 3-12
Section 4 FET Tests
Figure 4-1. Test configuration for common-source tests . . 4-2
Figure 4-2. Program 9 results: Common-source
characteristics . . . . . . . . . . . . . . . . . . . . . . 4-3
Figure 4-3. Configuration for transductance tests . . . . . 4-4
Figure 4-4. Program 10 results: Transconductance vs. V
GS
. 4-5
Figure 4-5. Program 10 results: Transconductance vs. I
D
. . 4-5
Figure 4-6. Configuration for search method
threshold tests . . . . . . . . . . . . . . . . . . . . . . 4-6
Figure 4-7. Configuration for self-bias threshold tests . . . 4-8
Section 5 Using Substrate Bias
Figure 5-1. TSP-Link connections for two instruments . . . 5-1
Figure 5-2. TSP-Link instrument connections . . . . . . . . 5-2
Figure 5-3. Program 12 test configuration . . . . . . . . . 5-3
Figure 5-4. Program 12 typical results: I
SB
vs. V
GS
. . . . . 5-4
Figure 5-5. Program 13 test configuration. . . . . . . . . . 5-5
Figure 5-6. Program 13 typical results: Common-source
characteristics with substrate bias . . . . . . . . . . . . 5-6
Figure 5-7. Program 14 test configuration . . . . . . . . . . 5-8
Figure 5-8. Program 14 typical results: Common-emitter
characteristics with substrate bias . . . . . . . . . . . . 5-9
Section 6 High Power Tests
Figure 6-1. High current (SMUs in parallel). . . . . . . . . 6-1
Figure 6-2. High voltage (SMUs in series) . . . . . . . . . . 6-2
Appendix A Scripts