HP ProLiant ML30 Gen10 Plus User Manual

DIMM installation guidelinesDIMM installation guidelines
When handling a DIMM, observe the following:
Observe antistatic precautions.
Hold the DIMM by the side edges only.
Do not touch the components on the sides of the DIMM.
Do not touch the connectors on the bottom of the DIMM.
Never wrap your fingers around a DIMM.
Never bend or flex the DIMM.
When installing a DIMM, observe the following:
To align and seat the DIMM, use two fingers to hold the DIMM along the side edges.
To seat the DIMM, use two fingers to apply gentle pressure along the top of the DIMM.
For more information, see the Hewlett Packard Enterprise website (https://www.hpe.com/support/DIMM-20070214-CNhttps://www.hpe.com/support/DIMM-20070214-CN).
DIMM installation guidelines 137

HP ProLiant ML30 Gen10 Plus Specifications

General

Processor Sockets	1
Memory	Up to 128 GB DDR4 ECC UDIMM
Memory Slots	4
Form Factor	Tower
Processor	Intel Xeon E-2300 series
Storage	Up to 4 LFF or 8 SFF drives
RAID Support	HPE Smart Array S100i, S100i SR Gen10 SW RAID
Network	1 x 1GbE
Power Supply	350W
Chipset	Intel C252
Storage Controller	HPE Smart Array S100i, S100i SR Gen10 SW RAID
Maximum Internal Storage	Up to 64 TB
Operating System Support	Windows Server, Red Hat Enterprise Linux, SUSE Linux Enterprise Server, VMware ESXi
Weight	Approx. 10.5 kg