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Chapter 3 Specications
Chapter 3 Specications
3.1 Application Environment Specications ...................................................................................
26
3.2 Hardware Performance Indicators of the CPU Module ...........................................................
26
3.3 Specications of the Power Module .........................................................................................
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3.4 Local Expansion Modules ...........................................................................................................
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3.4.1 DI Module ............................................................................................................................................
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3.4.2 DO Module ..........................................................................................................................................
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3.4.3 AI Module ............................................................................................................................................
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3.4.4 AO Module ...........................................................................................................................................
40
3.4.5 Temperature Module ..........................................................................................................................
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3.5 Remote Expansion Module (EtherCAT) ......................................................................................
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3.5.1 EtherCAT Communication Module ....................................................................................................
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3.5.2 I/O Module ..........................................................................................................................................
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3.5.3 High-speed Counting Module ............................................................................................................
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3.5.4 Positioning Module ............................................................................................................................
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3.6 Remote Expansion Module (Probus-DP) .................................................................................
51
3.7 Remote Expansion Module (CANopen) .....................................................................................
52