Particulate and gaseous contamination specications
Table 18. Particulate contamination specications
Particulate contamination Specications
Air ltration Data center air ltration as dened by ISO
Class 8 per ISO 14644-1 with a 95% upper
condence limit.
NOTE: This condition applies only to data center environments. Air ltration requirements do not apply to IT equipment
designed to be used outside a data center, in environments such as an oce or factory oor.
NOTE: Air entering the data center must have MERV11 or MERV13 ltration.
Conductive dust Air must be free of conductive dust, zinc
whiskers, or other conductive particles.
NOTE: This condition applies to data center and non-data center environments.
Corrosive dust Air must be free of corrosive dust.
Residual dust present in the air must have a deliquescent point less than 60% relative humidity.
NOTE: This condition applies to data center and non-data center environments.
Table 19. Gaseous contamination specications
Gaseous contamination Specications
Copper coupon corrosion rate <300 Å/month per Class G1 as dened by ANSI/ISA71.04-1985.
Silver coupon corrosion rate <200 Å/month as dened by AHSRAE TC9.9.
NOTE: Maximum corrosive contaminant levels measured at ≤50% relative humidity.
Standard operating temperature specications
NOTE
:
1 Not available: Indicates that the conguration is not oered by Dell EMC.
2 Not supported: Indicates that the conguration is not thermally supported.
NOTE: All components including the DIMMs, communication cards, M.2 SATA, and PERC cards can be supported with sucient
thermal margin if the ambient temperature is equal to or below to the maximum continuous operating temperature listed in these
tables with the exception of the Mellanox DP LP card.
Technical specications 21
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