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PREPARATION FOR USE
Overview
TP04300 Series Interface & Applications Manual 2-43
Section K: Static, Moisture, and Extreme Temperature
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Protection
Overview
Temperature transition times are dependent on mass, specific heat characteristics, thermal
coupling and thermal conduction paths to the DUT, test socket, test leads, and other fixturing
features.
This section offers how to optimize test site setup as follows:
1. Protect the test site from the buildup and discharge of static electricity
2. Prevent moisture infiltration at the DUT/socket and condensation buildup on the tester
platform and cables, the latter to prevent icing
3. Minimize undesired heat transfer at the DUT site to increase test efficiency and protect
tester board components from temperature extreme damages
To use one of Temptronic’s standard configured, or application-specific, custom configured
thermal test enclosures, see Turnkey Test Enclosures (page 2-49).
In this Section
Topic See Page
Electrostatic Discharge (ESD) Protection 44
Moisture Protection 45
Insulation (Minimizing Heat Conductivity) 47
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