2
PREPARATION FOR USE
Moisture Protection
2-46 TP04300 Series Interface & Applications Manual
Air Purging the
Tester Platform
Condensation, frosting and ice can appear on the tester platform (test board) and its test cables,
socket lead wires, and related interconnections, during low temperature testing unless the
platform area is properly purged with system-supplied dry air as given below.
For instance, if the tester platform is exposed to ambient room air which has a dew point on the
order of 15 °C, and if the ThermoStream outlet air is at a low temperature, then thermal
conduction and forced convection can cause condensation, frosting and/or icing to appear on
the tester cables.
The best way to prevent these conditions is to provide an air gap around the tester platform
lead wires and cables and to purge the area with dry air.
The TP04300 supplies dry purge air from an air purge outlet "PO," located on the frame
module back panel, as is the purge flow valve "PFV."
The purge air can be directed to where condensation is to be prevented (see Connecting Purged
Air, page 2-29).
At low temperatures, ThermoStream airflow has a very low dew point. Since it is very dry,
condensation within the thermal cap is not a concern.
Also, Temptronic can provide either standard or custom thermal test enclosures for your test
site (see Turnkey Test Enclosures, page 2-49).
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