• Part number: MT53D512M32D2DS-046 WT:D (dual die LPDDR4 SRAM)
• Component descripon
○ 16 Gb (512 Mb x 32)
○ 1.1V 200-ball WFBGA
○ DDR4-2133
The VCK190 XCVC1902 ACAP PL DDR interface performance is documented in the Versal Prime
Series Data Sheet: DC and AC Switching Characteriscs (DS956). The VCK190 board LPDDR4
component memory interfaces adhere to the constraints guidelines documented in the PCB
guidelines for DDR4 secon of Versal ACAP PCB Design User Guide (UG863). The VCK190 DDR4
component interface is a 40Ω impedance implementaon. Other memory interface details are
also available in the Versal ACAP Memory Resources Architecture Manual (AM007). For more
memory component details, see the Micron MT53D512M32D2DS data sheet at the Micron
website. The detailed ACAP connecons for the feature described in this secon are
documented in the VCK190 board XDC le, referenced in Appendix B: Xilinx Design Constraints.
System Reset POR_B
[Figure 3, callout 35]
POR_B is the Versal ACAP processor reset, which can be controlled by:
• SYSCTLR (U125)
• PC4 header (J36)
• MIO EBM (external boot module on J212)
• FTDI USB JTAG chip (U20)
In the following gure, U235 allows direconal open drain level shiing for all of these masters,
and J326 allows them to be bused together if desired. The h channel buers POR_B out to
the EBM (external boot module) as DC_PS_POR_B. The TPS389001 U10 supervisor chip holds
POR_B o unl power is valid. The VCK190 board POR circuit is shown in the gure.
Chapter 3: Board Component Descriptions
UG1366 (v1.0) January 7, 2021 www.xilinx.com
VCK190 Board User Guide 27