455/A2/B2
TABLE OF CONTENTS (cont)
SECTION 5 — MAINTENANCE (cont) Page
Soldering Techniques 5-3
Component Removal and Replacement 5-4
Rear Panel Assembly Removal 5-4
Cabinet Bottom Removal 5-4
Interconnecting Cable and Pin Connector
Replacement 5-4
Shaft-Knob Removal 5-6
Cathode Ray Tube (Crt) Removal 5-6
Vertical Module Removal 5-7
Scale-Factor LED Replacement 5-7
VOLTS/DIV Switch Assembly Removal 5-9
Substrate or Contact Replacement
Considerations 5-9
Actuator Assembly Replacement
Considerations 5-9
Hybrid 1C Removal 5-10
Horizontal Module Removal 5-11
Board Locations 5-11
A and B Timing Switch Board Removal 5-12
Trigger Board Removal 5-13
Horizontal Board Removal 5-13
Troubleshooting 5-14
Troubleshooting Aids 5-14
Troubleshooting Chart 5-14
Diagrams 5-14
Circuit Board Illustrations 5-14
Component Value Identification 5-14
Semiconductor Lead Configurations 5-14
Troubleshooting Equipment 5-14
Troubleshooting Techniques 5-16
Check Control Settings 5-16
Check Associated Equipment 5-16
Check Instrument Calibration 5-16
Visual Check 5-16
Isolate Trouble to a Circuit 5-16
Check Circuit Board Interconnections 5-16
Check Voltages and Waveforms 5-16
Check Individual Components 5-16
Repair and Readjust the Circuit 5-17
Repackaging For Shipment 5-20
SECTION 6 — ADJUSTMENTS
Tolerances 6-1
Adjustment Interaction 6-1
Partial Procedures 6-1
Test Equipment Required 6-1
A. Main Module 6-3
Preliminary Procedure 6-3
Procedure 6-3
B. Vertical Module 6-6
C. Horizontal Module 6-10
in
REV. C, NOV. 1977
To Next Page
Loading...
Need help?
General
