December 6, 2004 68P81083C20-D
2-4 Basic Maintenance: Audio PA Component Replacement Procedure
Audio PA Component Replacement Procedure
For High Power Models
1. Remove the main board from the chassis per disassembly instructions in Chapter 5.
2. Remove the faulty component in the Audio PA section of the main board. Ensure that the
through-holes are free of solder.
3. Place the main board in a chassis eliminator (Motorola Part Number 2705815W03). Assem-
ble the screws based on the Screw-Down sequence in Figure 5-21.
4. Place new component(s) in the proper location. Assemble the Audio PA Clip per the reas-
sembly instructions Step 8. on page 20.
5. Flip the chassis eliminator over.
6. Using a large tip soldering iron set to 750°F max, heat ground plane around through holes for
approximately 15 seconds. Dispense 6337 Tin Lead solder wire until a uniform solder fillet
exists. Repeat this operation for all leads.
7. Inspect solder joints. There should be a uniform fillet. The joints should be shiny and not dull
in appearance.
8. Remove the Audio PA clip per disassembly instructions Step 2. on page 10. Remove all
screws. Pull board out of chassis eliminator.
Antenna/Power Connector Replacement Procedure
For Low, Mid, and High Power Models
Note that Figures show High Power Chassis, but apply to all power levels.
1. Remove damaged connector by heating the solder joints until they reflow. Pull connector from
board with small pliers or like instrument.
Figure 2-1. RF and Power Connector Openings
2. Place new connector (either Power or RF) in opening in chassis (See Figure 2-1.). Connector
Part Numbers can be found in Chapter 10.
3. Install connector retaining clip over connector and chassis wall (See Figure 2-2.).
4. Install PA Board, aligning connector holes over connector pins per orientation in Figure 2-3.
Ensure that the undamaged connector has a retaining clip installed.
5. Screw down board using Torx drivers per the Assembly Section of Chapter 5. For High Power
radios, follow the screw-down sequence found in Figure 5-21.
6. Using a large tip soldering iron set to maximum 750°F/400°C, heat ground leads on connec-
tor for approximately 15 seconds. Dispense 6337 Tin Lead solder wire until a uniform solder
fillet exists.
This procedure must be used when replacing these
components to ensure proper alignment and heatsinking.
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