SDI7 module removal and replacement
To reassemble
theSDI7module
Reassembly is more complex than disassembly, and must be done in a specific
order to prevent damage to the SDI7 module. These procedures will start as if the
instrument h
as been completely disassembled. You may start at an appropriate
step and proceed to the end.
Installing the heat sink. Follow this procedure to install the heat sink.
NOTE. You can reuse a removed heat sink, but you must use a new gap pad.
1. Place the heat sink on the work surface as shown, with the bosses up.
2. Peel the protective film off of one side of the gap pad, and adhere the gap
pad to the top of the heat sink.
3. Peel the protective fi lm off of the top side of the gap pad.
4. Position the SDI7 Main circuit board over the heat sink and gap pad, aligning
the holes in the circuit board (on each side o f the FPGA) with the threaded
bosses of the heat sink. Press the circuit board down slightly to adhere the
gap pad to the circuit board.
5. Loosely install two of the T10 TORX screws through the circuit board and
into the heat sink.
CAUTION. To prevent damage to the FPGA, do not tighten these screws at this
time.
Reinstall the circuit board
into the chassis
Follow this procedure to reinstall the circuit board assembly i nto the c hassis.
Refer to the illustration in the SDI7 module replaceable parts list if necessary.
(See Figure 14-4 on page 14-31.)
1. Install the Trigger Output circuit board (878-0588-xx) into J910 of the Main
circuit board.
2. Install the first SDI Output circuit board (878-0602-xx) into J917 of the Main
circuit board, and then install the se cond into J922.
3. Slide the circuit board assembly onto the chassis, guiding the BNC connectors
through the holes in the rear panel.
14–28 TG8000 Multiformat Test Signal Generator Service Manual
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