Table 39. Thermal restriction for memory with liquid cooled configuration(GPU)
Configuration
No
backpl
ane
8 x 2.5-
inch
NVMe
16 x
2.5-
inch
SAS
16 x
2.5-
inch
NVMe
24 x 2.5-inch SAS
16 x
2.5-
inch
SAS +
8 x
2.5-
inch
NVMe
24 x 2.5-
inch
NVMe
Ambient
tempera
ture
Rear storage
No
rear
drives
No rear
drives
No
rear
drives
No
rear
drives
No rear
drives
2 x 2.5-
inch
with rear
fan
4 x 2.5-
inch
with
rear fan
No
rear
drives
No rear
drives
DIMM
Configu
ration
Power Fan
256 GB
RDIMM
12.7 W HPR GOLD fan 35°C
(95°F)
128 GB
RDIMM
8.9 W
64 GB
RDIMM
6.9 W
32 GB
RDIMM
4.1 W
16 GB
RDIMM
3 W
Thermal air restrictions
Table 40. Air cooling configurations thermal restriction for AHSRAE A3 and A4
ASHRAE A3/40°C (104°F) A4/45°C (113°F)
PSU Two PSUs are required in redundant mode. If there is PSU failure, system performance may be reduced.
PCIe card Non-Dell qualified peripheral cards and peripheral cards greater than 25 W are not supported.
GPU/FPGA Not supported
DIMM 128 GB, or greater capacity DIMMs are not supported.
PCIe SSD Not supported
Front storage Not supported in 12 x 3.5-inch SAS configuration.
Rear storage Not supported
Fan HPR SLVR fans are required.
Processor ≤ 165 W ≤ 125 W
OCP Supported with 85°C (185°F) active optic
cable.
Supported with 85°C (185°F) active optic cable and
cards tier ≤4.
BOSS BOSS-N1 is supported. BOS-N1 is not supported.
Table 41. Liquid cooling configurations thermal restriction for AHSRAE A3 and A4
ASHRAE A3/40°C (104°F) A4/45°C (113°F)
PSU Two PSUs are required in redundant mode. If there is PSU failure, system performance may be reduced.
PCIe card Non-Dell qualified peripheral cards and peripheral cards greater than 25 W are not supported.
GPU/FPGA Not supported
Technical specifications 47