Hardware Design notes
XBee/XBee-PRO® S2C ZigBee® RF Module
28
EM357
pin# EM357 pin name
XBee
(SMT)
pad#
XBee
(TH)
pin # Other usage
19 PB3 29 16 Used for UART
20 PB4 25 12 Used for UART
21 PA0/ SC2MOSI 16 11 Used for SPI
22 PA SC2MISO 17 4
Used for SPI
24 PA2/SC2SCLK 14 18
Used for SPI
25 PA3/SC2SSEL 15 17
Used for SPI
26 PA4/PTI_EN 32 19 OTA packet tracing
27 PA5/PTI_
DATA/BOOTMODE
12 NA OTA packet tracing, force embedded
serial bootloader, and SPI attention line
29 PA6 7 6
30 PB1/SC1TXD 3 2
Used for UART
31 PB2/SC1RXD 4 3
Used for UART
33 PC2/JTDO/SWO 26 13 JTAG (see Writing custom firmware)
34 PC3/JTDI 28 15 JTAG (see Writing custom firmware)
35 PC4/JTMS/SWDIO 5 4 JTAG (see Writing custom firmware)
36 PB0 10 9
38 PC1/ADC3 30 17
41 PB7/ADC2 31 18
42 PB6/ADC1 33 20
43 PB5/ADC0 Temperature sensor on PRO version
Design notes
The XBee modules do not require any external circuitry or specific connections for proper operation.
However, there are some general design guidelines that we recommend to build and troubleshoot a
robust design.
Power supply design
A poor power supply can lead to poor radio performance, especially if you do not keep the supply
voltage within tolerance or if it is excessively noisy. To help reduce noise, place a 1.0 µF and 8.2 pF
capacitor as near as possible to pad 2/SMT or pin 1/TH on the PCB. If you are using a switching
regulator for the power supply, switch the frequencies above 500 kHz. Limit the power supply ripple to
a maximum 50 mV peak to peak.
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