Manufacturing information Flux and cleaning
XBee/XBee-PRO® S2C ZigBee® RF Module
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Flux and cleaning
Digi recommends that a “no clean” solder paste be used in assembling these devices. This eliminates
the clean step and ensures unwanted residual flux is not left under the device where it is difficult to
remove.
In addition the following issues can occur:
n Cleaning with liquids can result in liquid remaining under the shield or in the gap between the
device and the OEM PCB. This can lead to unintended connections between pads on the device.
n The residual moisture and flux residue under the device are not easily seen during an
inspection process.
Factory recommended best practice is to use a “no clean” solder paste to avoid these issues and
ensure proper device operation.
Reworking
Never perform rework on the device itself. The device has been optimized to give the best possible
performance, and reworking the device itself will void warranty coverage and certifications. We
recognize that some customers choose to rework and void the warranty. The following information
serves as a guideline in such cases to increase the chances of success during rework, though the
warranty is still voided.
The device may be removed from the OEM PCB by the use of a hot air rework station, or hot plate. Be
careful not to overheat the device. During rework, the device temperature may rise above its internal
solder melting point and care should be taken not to dislodge internal components from their
intended positions.
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