Servicing the ZS3-2 Controller
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Maximum current AC RMS: 6.8 A @ 100-120 V / 3.4 A @ 200-240 V
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AC operating range: 90-264 VAC
Output
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3.3 VDC STBY: 3.0A
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+12 VDC: 86.7A
Power Dissipation
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Max power consumption: 890 W max
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Max heat output: 3026 BTU/hr
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Volt-Ampere rating: 908 VA @ 240 VAC, 0.98P.F.
ZS3-2 Acoustic Noise Emissions
In compliance with the requirements defined in ISO 7779, the workplace-dependent noise level
of this product is less than 70 db (A).
ZS3-2 Internal Boards
The ZS3-2 chassis has the following field replaceable units (FRUs). FRUs are not customer-
serviceable and must be replaced by trained Oracle service technicians.
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PCIe Risers - There are three risers per system, each attached to the rear of the
motherboard. Each riser supports two PCIe cards (which are customer replaceable units
(CRUs).
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Motherboard - The motherboard includes CPU modules, slots for 16 DIMMs, memory
control subsystems, and the service processor (SP) subsystem. The SP subsystem controls
the host power and monitors host system events (power and environmental). The SP
controller draws power from the host 3.3V standby supply rail, which is available whenever
the system is receiving AC input power, even when the system is turned off.
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Power Distribution Board - The power distribution board distributes main 12V power
from the power supplies to the rest of the controller. It is directly connected to the connector
break out board and to the motherboard through a bus bar and ribbon cable. It also
supports a top cover interlock kill switch. The power supplies connect directly to the power
distribution board.
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Storage Drive Backplane - The storage drive backplane includes the connectors for the
storage drives, as well as the interconnect for the I/O board, power and locator buttons, and
system/component status LEDs. The system has an 8-disk backplane. Each drive has an
LED indicator for Power/Activity, Fault, and Locate.
116 Oracle ZFS Storage Appliance Customer Service Manual • February 2016