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Sony ICP-X1224 User Manual

Sony ICP-X1224
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151
Select a wipe pattern in the same way as for the main
pattern.
Rotary wipe patterns cannot be selected.
Some patterns may not be available for a sub
p
attern, depending on the selected main pattern.
For details, see “Relationship between main
pattern and sub pattern” (page 150).
3
Open the Home > M/E-1 > Bus/Transition > Wipe >
Pattern Mix/Edge/Direction menu (11109.33).
4
In the [Pattern Mix] group, select a type of pattern
mix.
Mix: Mi
x
+ NAM: P
ositive NAM
– NAM: Negative NAM
Morphing: Mo
rphing
When the [Mix] button, [+ NAM] button, or [– NAM]
b
utton is selected, set the following parameter.
When the [Morphing] button is selected, set the
f
ollowing parameters.
5
In the [Main/Sub Link] group, configure the modifier
link.
Full:
Full link mode
Semi:
Semi link mode
To disable modifier link, set both the [Full] button
an
d [Semi] button to the off state.
Setting a dust mix
You can set a dust mix for a selected wipe pattern.
1
Open the Home > M/E-1 > Bus/Transition > Wipe >
Pattern Mix/Edge/Direction menu (11109.33).
2
Set the [Dust Mix] button to the on state and set the
following parameters.
Setting Modifiers
You can add modifiers to modify a wipe pattern.
Relationship between wipe pattern and
modifiers
Some modifiers may not be available, depending on the
wipe pattern.
The following table shows the supported modifiers for
each w
ipe pattern.
a: Available
×: Not available
a) Pattern numbers 1 to 16, 19, and 20 are not available.
b) Pattern numbers 300 to 303 are not available.
c) Pattern numbers 100 to 103, 150, 151, 156, 158, 604, and 606 are not
av
ailable.
d) Pattern numbers 1 to 8, 17, and 18 are not available.
e) Pattern numbers 220 to 223 are not available.
f) Pattern numbers 19 to 20 are not available.
g) Pattern numbers 1 to 20 and 22 are not available.
h) Pattern numbers 1 to 20, 22, and 24 are not available.
Main pattern and sub pattern modifiers
The following modifiers are common to the main pattern
and sub pattern.
Direction
Split
•Edge
Notes
No. Parameter Adjustment
1 Mix Ratio Proportion of sub pattern
r
elative to main pattern
No. Parameter Adjustment
1 Start Point in the transition at which
t
he main pattern is at 100%
2 End Point in the transition at which
t
he sub pattern is at 100%
No. Parameter Adjustment
1 Mix Ratio Proportion of diamond dust
w
ipe pattern
2 H Size Particle width
3 V Size Particle height
4 Flash Rate Rate of generation of
pa
rticles
Modifier Standard
wipes
Enhanced
wipes
Rotary
wipes
Mosaic
wipes
Random/
diamond
dust
wipes
Direction
a a a a a
Split
a a
×
a a
Edge
a a a a a
Position
a
a)
a
b)
a
c)
× ×
Rotation
a a a
c)
× ×
Aspect
a
d)
a
× × ×
Multiplication
a a a a
e)
×
Pairing
a
f)
a
× × ×
Modulation
(H, V)
a a a
× ×
Modulation
(Fringe)
a
g)
a
× × ×
Spring
a
g)
a
× × ×
Spiral
a
h)
a
× × ×
No. Parameter Adjustment

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Sony ICP-X1224 Specifications

General IconGeneral
BrandSony
ModelICP-X1224
CategorySwitch
LanguageEnglish

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