24 Rockwell Automation Publication 2097-UM002D-EN-P - April 2017
Chapter 2 Install the Kinetix 350 Drive System
Electrical Noise Reduction
This section outlines practices that minimize the possibility of noise-related
failures as they apply specifically to Kinetix 350 system installations. For more
information on the concept of high-frequency (HF) bonding, the ground
plane principle, and electrical noise reduction, refer to the System Design for
Control of Electrical Noise Reference Manual, publication GMC-RM001
.
Bonding Drives
Bonding is the practice where you connect metal chassis, assemblies, frames,
shields, and enclosures to reduce the effects of electromagnetic interference
(EMI).
Unless specified, most paints are not conductive and act as insulators. To
achieve a good bond between drive and the subpanel, surfaces must be paint-
free or plated. Bonded metal surfaces create a low-impedance return path for
high-frequency energy.
Improper bonding of metal surfaces blocks the direct return path and lets high-
frequency energy travel elsewhere in the cabinet. Excessive high-frequency
energy can affect the operation of other microprocessor controlled equipment.
IMPORTANT To improve the bond between the drive and subpanel, construct your
subpanel out of zinc plated (paint-free) steel.
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