26 Rockwell Automation Publication 2097-UM002D-EN-P - April 2017
Chapter 2 Install the Kinetix 350 Drive System
Bonding Multiple Subpanels
Bonding multiple subpanels creates a common low-impedance exit path for the
high frequency energy inside the cabinet. Subpanels that are not bonded
together cannot share a common low impedance path. This difference in
impedance can affect networks and other devices that span multiple panels:
• Bond the top and bottom of each subpanel to the cabinet by using
25.4 mm (1.0 in.) by 6.35 mm (0.25 in.) wire braid. As a rule, the wider
and shorter the braid is, the better the bond.
• Scrape the paint from around each fastener to maximize metal-to-metal
contact.
Figure 5 - Multiple Subpanels and Cabinet Recommendations
Wire Braid
25.4 mm (1.0 in.) by
6.35 mm (0.25 in.)
Remove paint
from cabinet.
Ground bus
that is bonded
to the
subpanel.
Wire Braid
25.4 mm (1.0 in.) by
6.35 mm (0.25 in.)
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