Intel 855GME User Manual

280
Intel
®
855GME Chipset and Intel
®
6300ESB ICH Embedded Platform Design Guide
Schematic Checklist Summary
12.3.4.3 Digital-to-Analog Converter (DAC) Checklist
Table 128 presents the DAC checklist.
Table 128. DAC Checklist
Pin
Name
System
Pull-up/Pull-down
In Series Notes
√
REFSET
124-137
Ω 1% pull-down
to GND
137
Ω used on Intel CRB.
RED # Connect to GND. Need to connect to RED’s return path.
BLUE # Connect to GND. Need to connect to BLUE’s return path.
GREEN# Connect to GND. Need to connect to GREEN’s return path.
RED
On GMCH side of ferrite
bead:
75
Ω 1% pull-down to
GND, 3.3 pF cap to GND,
ESD diode protection for
V_1P5_CORE
On VGA side of ferrite
bead:
3.3 pF cap to GND
Ferrite
bead: 75
Ω
at 100 MHz
Ferrite bead for EMI suppression between
GMCH and VGA connector.
BLUE
On GMCH side of ferrite
bead:
75
Ω 1% pull-down to
GND, 3.3 pF cap to GND,
ESD diode protection for
V_1P5_CORE.
On VGA side of ferrite
bead:
3.3 pF cap to GND
Ferrite
bead: 75
Ω
at 100 MHz
Ferrite bead for EMI suppression between
GMCH and VGA connector.
GREEN
On GMCH side of ferrite
bead:
75
Ω 1% pull-down to
GND, 3.3 pF cap to GND,
ESD diode protection for
V_1P5_CORE
On VGA side of ferrite
bead:
3.3 pF cap to GND
Ferrite
bead: 75
Ω
at 100 MHz
Ferrite bead for EMI suppression between
GMCH and VGA connector.
HSYNC
33 pF cap to GND at
connector (470 pF
†
)
39
Ω
Requires unidirectional buffer. See
Section 6.1.6.
VSYNC
33 pF cap to GND at
connector (470 pF
†
)
39
Ω
Requires unidirectional buffer. See
Section 6.1.6.
† Value used on Intel CRB.

Intel 855GME Specifications

General

Brand	Intel
Model	855GME
Category	Computer Hardware
Language	English