I/O Controller Hub 2
R
Intel
®
Pentium
®
4 Processor / Intel
®
850 Chipset Family Platform Design Guide 175
9.9.3.5.3 Distance from LPF to Phone RJ11
This distance ‘C’ should be less then 1 inch. In regards to trace symmetry, route differential pairs
with consistent separation and with exactly the same lengths and physical dimensions.
Asymmetrical and unequal length in the differential pairs contribute to common mode noise and
this can degrade the receive circuit performance and contribute to radiated emissions from the
transmit side
9.9.4 Intel
®
82562ET / 82562EM Guidelines
For correct LAN performance, designers must follow the general guidelines outlined in
Section 9.9.2. Additional guidelines for implementing a 82562ET or 82562EM LAN connect
component are provided below.
9.9.4.1 Guidelines for Intel
®
82562ET / 82562EM Component Placement
Component placement can affect signal quality, emissions, and temperature of a board design.
This section will provide guidelines for component placement.
Careful component placement can:
• Decrease potential problems directly related to electromagnetic interference (EMI), which
could cause failure to meet FCC and IEEE test specifications.
• Simplify the task of routing traces. To some extent, component orientation will affect the
complexity of trace routing. The overall objective is to minimize turns and crossovers
between traces.
Minimizing the amount of space needed for the Ethernet LAN interface is important because all
other interface will compete for physical space on a motherboard near the connector edge. As with
most subsystems, the Ethernet LAN circuits need to be as close as possible to the connector. Thus,
it is imperative that all designs be optimized to fit in a very small space.