Intel Pentium 4 User Manual

Intel® Pentium® 4 Processor in the 478-Pin Package Processor Power Distribution Guidelines
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220 Intel
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Pentium
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4 Processor / Intel
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850 Chipset Family Platform Design Guide
Figure 164. Routing of VR Feedback Signal
11.2 Thermal Considerations
11.2.1 FMB1
For a power delivery solution to meet the flexible motherboard (FMB) requirements, it must be
able to delivery a fairly high amount of current. This high amount of current also requires that the
solution is able to dissipate the associated heat generated by the components and keep all of the
components and the PCB within their thermal specifications. OEMs should evaluate their
component configurations, system airflow and layout to ensure adequate thermal performance of
the processor power delivery solution.
11.2.2 FMB2
For a power delivery solution to meet the flexible motherboard (FMB2) requirements, it must be
able to delivery a high amount of current. This high amount of current also requires that the
solution is able to dissipate the associated heat generated by the components and keep all of the
components and the PCB within their thermal specifications. OEMs should evaluate their
component configurations, system airflow and layout to ensure adequate thermal performance of
the processor power delivery solution.
The table below shows the required amount of airflow needed for the documented designs to meet
FMB2 specifications and component thermal requirements.

Intel Pentium 4 Specifications

General

Brand	Intel
Model	Pentium 4
Category	Computer Hardware
Language	English