Intel Pentium 4 User Manual

Platform Placement and Stack-Up Overview
R
38 Intel
®
Pentium
®
4 Processor / Intel
®
850 Chipset Family Platform Design Guide
3.2.3 Four-Layer Motherboard Stack-Up
The following figure shows a 4-layer stack-up.
• If possible, signals should be referenced to a V
SS
plane.
Figure 10. 4-Layer Intel
®
Pentium
®
4 Processor in the 478 Pin Package and Intel
®
850 Chipset Example Stack-Up for µATX Form Factor
Total Thickness: 62 mils
4.5 Mil Prepreg
Component Side Layer 1 ½ oz cu
~48 Mil Core
Gound Layer 3 1 oz cu
4.5 Mil Prepreg
Solder Side Layer 4 ½ oz cu
Power Plane Layer 2 1 oz cu
Design Considerations
Intel has found that the following recommendations aid in the design of an Intel Pentium 4
processor-based platform.
• Impedance requirements
 60-ohm impedance ± 15% for AGP at 5mil trace width
 50-ohm impedance ± 15% for the system bus at 7 mil trace width
 28-ohm impedance ± 10% for the memory interface at 18 mil trace width
• Minimum via size is 12 mil finished in a 26 mil land with 35 mil antipad

Intel Pentium 4 Specifications

General

Architecture	x86
Core Count	1
Microarchitecture	NetBurst
Manufacturer	Intel
Core Names	Willamette, Northwood, Prescott, Cedar Mill
Virtualization Technology	No
Release Date	November 20, 2000
Clock Speed	1.3 GHz to 3.8 GHz
FSB Speed	400 MHz to 1066 MHz
Socket	Socket 423, Socket 478, LGA 775
Introduced	2000
Product Line	Pentium
Front Side Bus	400 MHz to 1066 MHz
Hyper-Threading	Yes (Prescott and later)
64-bit Support	Yes (Prescott and later)
Instruction Set	MMX, SSE, SSE2, SSE3
Discontinued	2008
Process Technology	180 nm, 130 nm, 90 nm, 65 nm
L2 Cache	256 KB, 512 KB, 1 MB, 2 MB
Lithography	180 nm, 130 nm, 90 nm, 65 nm
L1 Cache	8 KB