Intel Pentium 4 User Manual

Introduction
R
Intel
®
Pentium
®
4 Processor / Intel
®
850 Chipset Family Platform Design Guide 7
9.9.3.5.2
Distance from Intel
®
82562EH to Magnetics
Module ............................................................... 174
9.9.3.5.3 Distance from LPF to Phone RJ11 .................... 175
9.9.4 Intel
®
82562ET / 82562EM Guidelines................................................ 175
9.9.4.1 Guidelines for Intel
®
82562ET / 82562EM Component
Placement.......................................................................... 175
9.9.4.2 Crystals and Oscillators ..................................................... 176
9.9.4.3 Intel
®
82562ET / 82562EM Termination Resistors ............ 176
9.9.4.4 Critical Dimensions............................................................ 176
9.9.4.4.1 Distance from Magnetics Module to RJ45......... 177
9.9.4.4.2 Distance from Intel
®
82562ET to Magnetics
Module ............................................................... 178
9.9.4.5 Reducing Circuit Inductance.............................................. 178
9.9.4.6 Terminating Unused Connections ..................................... 178
9.9.4.6.1 Termination Plane Capacitance ........................ 179
9.9.5 Intel
®
82562 ET/EM Disable Guidelines.............................................. 180
9.9.6 82562ET / 82562EH Dual Footprint Guidelines.................................. 181
9.10 Intel
®
ICH2 Routing Guidelines – Four-Layer Motherboard................................ 183
9.11 FWH Guidelines ................................................................................................. 185
9.11.1 FWH Decoupling................................................................................. 185
9.11.2 In Circuit FWH Programming.............................................................. 185
9.11.3 FWH Vpp Design Guidelines .............................................................. 185
9.12 Intel
®
ICH2 Decoupling Recommendations........................................................ 186
9.13 Glue Chip 4 (Intel
®
ICH2 Glue Chip)................................................................... 186
9.14 SPKR Pin Consideration..................................................................................... 187
9.15 1.8 V and 3.3 V Power Sequence Requirement................................................. 188
9.16 PIRQ Routing...................................................................................................... 189
10 Additional Design Considerations ................................................................................... 191
10.1.1 Retention Mechanism Placement and Keepouts ................................ 191
10.1.2 Power Header for Active Cooling Solutions ........................................ 195
11 Intel
®
Pentium
®
4 Processor in the 478-Pin Package Processor Power Distribution
Guidelines ....................................................................................................................... 197
11.1 Power Requirements .......................................................................................... 197
11.1.1 FMB1 VR Component Placement....................................................... 198
11.1.2 FMB2 VR Component Placement....................................................... 199
11.1.3 FMB1 Decoupling Requirements ........................................................ 200
11.1.4 FMB2 Decoupling Requirements ........................................................ 202
11.1.5 FMB1 Layout (6-Layer Board)............................................................. 205
11.1.6 FMB2 Four–Phase Layout (4-Layer Board) ........................................ 212
11.1.7 FMB2 – Three-Phase Layout (4-Layer Board).................................... 214
11.1.8 FMB1 – Common Layout Issues......................................................... 217
11.1.9 FMB2 - Common Layout Issues ......................................................... 219
11.2 Thermal Considerations ..................................................................................... 220
11.2.1 FMB1................................................................................................... 220
11.2.2 FMB2................................................................................................... 220
11.2.3 FMB2 - Voltage Regulator Thermal Protection Circuit........................ 221
11.3 Simulation ........................................................................................................... 223
11.3.1 FMB1................................................................................................... 223
11.3.2 FMB2................................................................................................... 224
11.4 Filter Specifications For VCCA, VCCIOPLL, and VSSA..................................... 225

Intel Pentium 4 Specifications

General

Architecture	x86
Core Count	1
Microarchitecture	NetBurst
Manufacturer	Intel
Core Names	Willamette, Northwood, Prescott, Cedar Mill
Virtualization Technology	No
Release Date	November 20, 2000
Clock Speed	1.3 GHz to 3.8 GHz
FSB Speed	400 MHz to 1066 MHz
Socket	Socket 423, Socket 478, LGA 775
Introduced	2000
Product Line	Pentium
Front Side Bus	400 MHz to 1066 MHz
Hyper-Threading	Yes (Prescott and later)
64-bit Support	Yes (Prescott and later)
Instruction Set	MMX, SSE, SSE2, SSE3
Discontinued	2008
Process Technology	180 nm, 130 nm, 90 nm, 65 nm
L2 Cache	256 KB, 512 KB, 1 MB, 2 MB
Lithography	180 nm, 130 nm, 90 nm, 65 nm
L1 Cache	8 KB