Publication 2094-UM001A-EN-P — September 2006
Planning the Kinetix 6000 Drive System Installation 27
Minimizing Electrical
Noise
This section outlines best practices which minimize the possibility of
noise-related failures as they apply specifically to Kinetix 6000 system
installations. For more information on the concept of high-frequency
(HF) bonding, the ground plane principle, and electrical noise
reduction, refer to the System Design for Control of Electrical Noise
Reference Manual, publication GMC-RM001.
Bonding Modules
Bonding is the practice of connecting metal chassis, assemblies,
frames, shields, and enclosures to reduce the effects of
electromagnetic interference (EMI).
Unless specified, most paints are not conductive and act as insulators.
To achieve a good bond between power rail and the subpanel,
surfaces need to be paint-free or plated. Bonding metal surfaces
creates a low-impedance return path for high-frequency energy.
Improper bonding blocks the direct return path and allows
high-frequency energy to travel elsewhere in the cabinet. Excessive
high-frequency energy can effect the operation of other
microprocessor controlled equipment.
IMPORTANT
To improve the bond between the power rail and subpanel,
construct your subpanel out of zinc plated (paint-free) steel.
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