TX140 S1 Upgrade and Maintenance Manual 319
Processors
11.2.6 Applying thermal paste
I For the Japanese market, the service engineer must follow the
instruction provided separately.
I If the processor upgrade or replacement kit contains a new CPU heat
sink, a thin layer of thermal compound has already been pre-applied to
its lower surface. In this case, please proceed with section "Installing the
processor heat sink" on page 321.
Figure 177: Thermal paste syringe
One thermal compound syringe (FTS-FSP:P304000004) contains thermal
paste for three processors.
In order to determine the correct amount of thermal paste (equal to 1.0 gram),
divide the grey area of the syringe up into three equal segments.
I Add graduation marks to the syringe using a permanent marker to help
you apply the thermal paste.
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