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Nvidia Jetson AGX Xavier Series User Manual

Nvidia Jetson AGX Xavier Series
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Jetson AGX Xavier Series Product DG-09840-001_v2.5 | 34
Chapter 6. General Routing Guidelines
6.1 Signal Name Conventions
The following conventions are used in describing the signals for Jetson AGX Xavier:
ï‚„ Signal names use a mnemonic to represent the function of the signal. For example,
Secure Digital Interface #3 Command signal is represented as SDCARD_CMD, written in
bold to distinguish it from other text. All active low signals are identified by a # or an
underscore followed by capital N (_N) after the signal name. For example, RESET_IN#
indicates an active low signal. Active high signals do not have the underscore-N (_N) after
the signal names. For example, SDCARD_CMD indicates an active high signal. Differential
signals are identified as a pair with the same names that end with _P and _N, just P and N
or + and - (for positive and negative, respectively). For example, USB1_DP and USB1_DN
indicate a differential signal pair.
ï‚„ I/O Type The signal I/O type is represented as a code to indicate the operational
characteristics of the signal. The following table lists the I/O codes used in the signal
description tables.
Table 6-1. Signal Type Codes
Code Definition
A
Analog
DIFF I/O
Bidirectional Differential Input/Output
DIFF IN
Differential Input
DIFF OUT
Differential Output
I/O
Bidirectional Input/Output
I
Input
O
Output
OD
Open Drain Output
I/OD
Bidirectional Input / Open Drain Output
P
Power

Table of Contents

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Nvidia Jetson AGX Xavier Series Specifications

General IconGeneral
GPU512-core Volta GPU with Tensor Cores
CPU8-core ARM v8.2 64-bit CPU, 8MB L2 + 4MB L3
Memory32GB 256-Bit LPDDR4x | 137GB/s
Storage32GB eMMC 5.1
DL Accelerator2x NVDLA Engines
Vision Accelerator7-way VLIW Vision Processor
Dimensions105 mm x 105 mm
AI Performance32 TOPS (INT8)
Connectivity10/100/1000 BASE-T Ethernet
PCIe16x PCIe Gen4
USBUSB 3.1, USB 2.0
Power10W / 15W / 30W
DisplayeDP

Summary

Chapter 1. Introduction

Abbreviations and Definitions

Lists and defines abbreviations used in the document.

Chapter 3. Main Connector Details

Connector Pin Orientations

Describes the pinout and orientation of the 699-pin connector.

Module to Carrier Board Spacing

Details spacing requirements between module and carrier boards.

Standoff Height Recommendations

Provides recommendations for standoff heights for module mounting.

Module Installation and Removal

Outlines the procedure for installing and removing the module.

Chapter 5. Power

Power Supply Allocation

Details the internal power subsystem allocation for the module.

Power Sequencing

Describes the power-on sequencing requirements for system startup.

SYS_VIN_HV Input

Explains the main system power supply input for SYS_VIN_HV.

Power-On Features

Details the various power-on features and methods for the module.

Power Discharge

Covers the requirements and considerations for power discharge circuitry.

Power and Voltage Monitoring

Describes the power and voltage monitoring capabilities.

Deep Sleep and SC7 Modes

Explains the low power states supported by the module.

Chapter 6. General Routing Guidelines

Signal Name Conventions

Explains the conventions used for naming signals in the document.

Routing Guideline Format

Describes the format used for specifying signal routing guidelines.

Signal Routing Conventions

Outlines the conventions used for signal routing.

Routing Guidelines Overview

Provides an overview of routing rules for high-speed interfaces.

General PCB Routing Guidelines

Offers general guidelines for PCB routing to minimize crosstalk.

Chapter 7. USB, PCIe, and UFS

USB Interface Details

Covers USB 2.0 and USB 3.1 port implementations and guidelines.

PCI Express Interface Details

Details the PCI Express lanes and their configurations.

UFS Interface Details

Describes the UFS interface and its design guidelines.

Chapter 9. Display

DisplayPort and eDP Interfaces

Covers DisplayPort and embedded DisplayPort interfaces and guidelines.

HDMI Interface

Details the HDMI interface support and connection examples.

Chapter 10. Video Input

MIPI CSI Interface

Explains the MIPI CSI interfaces and their configurations.

SLVS Camera Interface

Covers the SLVS-EC interface for cameras.

Chapter 11. SDIO and SD Card

SD Card Interface

Details the SD card interface, connections, and routing requirements.

Chapter 12. Audio

I2S Design Guidelines

Provides signal routing requirements for the I2S interface.

DMIC Design Guidelines

Outlines signal routing requirements for the DMIC interface.

Chapter 13. Miscellaneous Interfaces

I2C Interface

Details the I2C controllers and their mapping.

SPI Interface

Covers the SPI interfaces and their pin descriptions.

UART Interface

Details the UART interfaces and their pin descriptions.

CAN Interface

Covers the CAN interfaces and their pin descriptions.

Chapter 15. Debug and Strapping

USB Recovery Mode

Explains the USB recovery mode for flashing and debugging.

JTAG and Debug UART Connections

Shows the connections for JTAG and debug UART interfaces.

Strapping Pins

Describes the strapping pins for system configuration.

Boundary Scan Test Mode

Details the requirements for supporting boundary scan test mode.

Safety MCU Connections (JAXi)

Outlines connections for the safety MCU on JAXi variants.

Chapter 16. Pads

MPIO Pad Behavior with Power Rails

Explains MPIO pad behavior when associated power rails are enabled/disabled.

Schmitt Trigger Usage

Describes the use of Schmitt triggers on MPIO pins for noise immunity.

Pins Pulled and Driven During Power-on

Details pins that are pulled or driven during the power-on sequence.

MPIO Pad Drive Strength

Provides maximum MPIO pad output drive current specifications.

Chapter 17. Unused Interface Terminations

Unused MPIO Interfaces

Lists MPIO pins that can be left unconnected if unused.

Unused SFIO Interface Pins

Identifies unused SFIO interface pins for potential use.

Chapter 19. General Layout Guidelines

Via Guidelines

Provides guidelines for via count, placement, and types.

Connecting Vias

Discusses the importance of proper via connections for effectiveness.

Trace Guidelines

Covers trace length, impedance, and layer stack-up requirements.

Chapter 20. Stack-Ups

Reference Design Stack-ups

Details the reference design stack-up definitions and their impact.

Chapter 21. Transmission Line Primer

Transmission Line Theory

Provides a primer on basic board-level transmission line theory.

Physical Transmission Line Types

Describes microstrip and stripline transmission line types.

Driver Characteristics

Explains key driver equations for signal integrity.

Receiver Characteristics

Covers receiver concepts for optimum signal integrity.

Transmission Lines and Reference Planes

Discusses reference plane identification for signal integrity.

Chapter 22. Design Guideline Glossary

Trace Delay

Defines maximum trace delay and breakout delay.

Intra and Inter Pair Skews

Explains delay differences within and between differential pairs.

Impedance and Spacing

Defines trace impedance, spacing, and microstrip vs. stripline.

Reference Return

Covers ground reference return vias and proximity.

Chapter 23. USB SS and Wireless Coexistence

USB SS Mitigation Techniques

Provides techniques to minimize USB SS de-sense issues.

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