Nvidia Jetson AGX Xavier Series User Manual

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Jetson AGX Xavier Series Product DG-09840-001_v2.5 | 75
Parameter Requirement Units Notes
ESD
(On-chip protection diode is able to withstand 2kV HMM. External ESD is optional. Designs should
include ESD footprint as a stuffing option)
Max junction capacitance (IO to GND) 0.35 pF e.g. ON-semiconductor ESD8040
Footprint
Pad right on the net instead of trace
stub
Location
After pull-down resistor/CMC and
before RS
Void
GND/PWR void under/above the cap
is needed. Void size = 1mm x 2mm
for 1 pair
Series Resistor (RS) – Series resistor on P/N path for HDMI 2.0 (Mandatory)
Value ≤ 6 Ω
± 10%. 0ohm is acceptable if the design
passes the HDMI2.0 HF1-9 test. Otherwise,
adjust the RS value to ensure the HDMI2.0
tests pass: Eye diagram, Vlow test and HF1-
9 TDR test
Location
After all components and before
HDMI connector
Void
GND/PWR void under/above the RS
device is needed. Void size = SMT
area + 1x dielectric height keepout
distance.
Connector
Connector Voiding
Voiding the ground below the signal
lanes 0.1448(5.7mil) larger than the
pin itself
General
Routing over Voids
Routing over voids not allowed except void around device ball/pin the signal is
routed to.
Noise Coupling
Keep critical HDMI related traces including differential clock/data traces and
RSET trace away from other signal traces or unrelated power traces/areas or
power supply components
Notes:
1. The average of the differential signals is used for length matching.
2. Do not perform length matching within breakout region. Recommend doing trace length matching to <1ps before vias or any
discontinuity to minimize common mode conversion
3. If routing includes a flex or 2nd PCB, the max trace delay and skew calculations must include all the PCBs/flex routing.
Solutions with flex/2nd PCB may not achieve maximum frequency operation.

Nvidia Jetson AGX Xavier Series Specifications

General

Brand	Nvidia
Model	Jetson AGX Xavier Series
Category	Computer Hardware
Language	English