38 Rockwell Automation Publication 2198-UM001M-EN-P - November 2022
Chapter 2 Plan the Kinetix 5500 Drive System Installation
Electrical Noise Reduction This section outlines best practices that minimize the possibility of noise-
related failures as they apply specifically to Kinetix 5500 system installations.
For more information on the concept of high-frequency (HF) bonding, the
Ground Plane principle, and electrical noise reduction, refer to the System
Design for Control of Electrical Noise Reference Manual, publication
GMC-RM001
.
Bonding Modules
Bonding is the practice of connecting metal chassis, assemblies, frames,
shields, and enclosures to reduce the effects of electromagnetic interference
(EMI).
Unless specified, most paints are not conductive and act as insulators. To
achieve a good bond between power rail and the subpanel, surfaces must be
paint-free or plated. Bonding metal surfaces creates a low-impedance return
path for high-frequency energy.
Improper bonding of metal surfaces blocks the direct return path and allows
high-frequency energy to travel elsewhere in the cabinet. Excessive high-
frequency energy can affect the operation of other microprocessor-controlled
equipment.
Figure 16 on page 39
shows recommended bonding practices for painted
panels, enclosures, and mounting brackets.
IMPORTANT To improve the bond between the power rail and subpanel, construct
your subpanel out of zinc-plated (paint-free) steel.
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