RL78/G15 CHAPTER 1 OUTLINE
R01UH0959EJ0110 Rev.1.10 Page 22 of 765
Mar 7, 2023
1.2 List of Part Numbers
Figure 1-1. Part Number, Memory Size, and Package of RL78/G15
Part No. R 5 F 1 2 0 6 8 M S P #V0
Packaging specifications
#
00
:
Tray (Full carton) (HWQFN)
#10: Tray (Full carton) (LSSOP,
SSOP,
WDFN
)
#20: Tray (HWQFN)
#30
: Tray
(
LSSOP, SSOP
, WDFN)
Tube (LSSOP
)
Note 1
#
40:
Embossed Tape
(HWQFN
)
#50: Embossed Tape
(LSSOP
, SSOP, WDFN)
Package type
SP: 10-pin, LSSOP,
0
.65
-mm pitch
16-
pin,
SSOP
, 0
.65
-
mm pitch
20
-pin, LSSOP, 0.
65-mm pitch
NA: 16-pin
, HWQFN, 0
.5-
mm pitch
NS:
8-
pin, WDFN
, 0
.65
-
mm pitch
Fields of application
A
: Consumer applications,
T
A
= –40°C to +85°C
G
: Industrial applications
, T
A
= –40°C to +
105°C
M:
Industrial applications, T
A
= –40°C to
+
125°C
ROM capacity
7: 4 KB
8: 8 KB
Pin count
0: 8
-pin
1:
10-pin
4: 16
-pin
6: 20-pin
RL78/G15 group: 120
Memory type
F: Flash memory
Renesas MCU
Renesas semiconductor product
Note 1. For the 20-pin LSSOP products only, the packaging specification is Tube.