Cooling circuit and coolant properties
13.4 Equipotential bonding in the cooling system
Booksize Power Units
Manual, (GH2), 07/2016, 6SL3097-4AC00-0BP8
783
Equipotential bonding in the cooling system
Equipotential bonding between the components in the cooling system is required (SINAMICS
S120, heat exchanger, piping, pump, etc.). This must be effected using a copper bar or
stranded copper with the appropriate conductor cross-sections to prevent the
electrochemical processes.
All cabinets must be bolted together in such a way as to ensure good conductivity (e.g.
cabinet beams directly connected to ensure a good electrical connection) to prevent potential
differences and, in turn, avoid the risk of electrochemical corrosion. As a consequence, a PE
bar must also be installed in all the cabinets, including the cooling system.
Using heat exchangers
13.5.1
Water-to-water heat exchanger
If a cooling circuit that does not exceed 35 °C but does not fulfill the cooling water
requirements is already installed in the system, the two cooling circuits can be linked via a
water-to-water heat exchanger.
The coolers for the Line Modules are attached via a distributor in such a way as to ensure
the required flow rate without exceeding the maximum permissible pressure. Conditions,
such as height differences and distances, must be taken into account here.
Figure 13-4 Water-to-water heat exchanger
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